Semiconductor device packages and related methods

A method of making semiconductor device packages, comprising:

• stacking semiconductor dice on laterally spaced regions of integrated circuitry on an active surface of a semiconductor wafer, a first semiconductor die in each stack located proximate the semiconductor wafer being connected through thermo-compression bonds to a region of integrated circuitry of the semiconductor wafer, each stack of the semiconductor dice including electrically conductive elements exposed on a side thereof opposite the semiconductor wafer;
• testing each stack of the semiconductor dice via the electrically conductive elements;
• singulating semiconductor device modules comprising stacks of the semiconductor dice and a region of integrated circuitry of the semiconductor wafer;
• electrically connecting sets of the semiconductor device modules confirmed to be operative during testing through electrically conductive elements of the regions of integrated circuitry opposite stacks of semiconductor dice to electrical connections of corresponding laterally adjacent package locations on a surface of a support structure;
• at least partially surrounding side surfaces of the semiconductor dice of each semiconductor module on the surface of the support structure in a molding material after singulating the semiconductor device modules and electrically connecting the sets of the semiconductor device modules to the electrical connections of the corresponding laterally adjacent package locations on the surface of the support structure;
• and
• singulating semiconductor device packages each comprising a set of the semiconductor device modules and a corresponding location of the support structure.