Systems and method for integrated devices on an engineered substrate

A method of forming a plurality of devices comprising:

• forming a substrate by:
• providing a polycrystalline ceramic core;
• encapsulating the polycrystalline ceramic core with an adhesion shell;
• encapsulating the adhesion shell with a barrier layer;
• forming a bonding layer on the barrier layer;
• and
• forming a substantially single crystal layer coupled to the bonding layer;
• forming a conducting layer coupled to the substantially single crystal layer;
• forming a buffer layer coupled to the conducting layer;
• forming one or more epitaxial III-V layers on the buffer layer according to requirements for each of the plurality of devices;
• and
• forming the plurality of devices by:
• removing a portion of the one or more epitaxial layers and a portion of the buffer layer disposed between the plurality of devices to expose a portion of the conducting layer;
• forming a contact coupled to a portion of the exposed portion of the conducting layer;
• and
• removing a remaining exposed portion of the conducting layer not coupled to the contact.