Support assembly and support assembly assembling method
AssigneeTokyo Electron Limited
InventorTakehiro UEDA
Life of this patent
Estimating the term…
Abstract
A support assembly includes an electrostatic chuck, a lower electrode, one or more conductive members and a ring-shaped insulating member. The lower electrode has a chuck support surface which supports the electrostatic chuck and a ring support surface which supports an edge ring and surrounds the chuck support surface. A contact electrode is formed on the ring support surface. The conductive members electrically connect the contact electrode and the edge ring. The insulating member is interposed between the ring support surface of the lower electrode and the edge ring while enclosing the conductive members.
Claims9
A support assembly comprising:
- an electrostatic chuck;
- a lower electrode having a chuck support surface which supports the electrostatic chuck and a ring support surface which supports an edge ring and surrounds the chuck support surface, wherein a contact electrode is formed on the ring support surface;
- one or more conductive members configured to electrically connect the contact electrode and the edge ring;
- and
- a ring-shaped insulating member interposed between the ring support surface of the lower electrode and the edge ring, the insulating member enclosing said one or more conductive members.
A support assembly assembling method, comprising:
- preparing an electrostatic chuck, an edge ring, a lower electrode having a chuck support surface which supports the electrostatic chuck and a ring support surface which supports the edge ring and surrounds the chuck support surface, and an insulating member enclosing one or more conductive members;
- forming a contact electrode on the ring support surface;
- and
- fixing the edge ring on the ring support surface through the insulating member to electrically connect the contact electrode, said one or more conductive members and the edge ring.
Dependencies are inferred from the claim text.