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US 2019/0172687 A1Published application
Ring-shaped electrode
AssigneeThinkon New Technology Japan Corporation
InventorsAtsushi Ikari, Satoshi Fujii
Life of this patent
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Abstract
A ring-shaped electrode includes a silicon ring body, and a cover body joined to at least a part of a surface of the ring body via a joining part, and having a better plasma resistance than silicon. The joining part has a heat resistance to withstand a temperature of at least 150° C., melts at 700° C. or below, and contains boron oxide.
Claims5
A ring-shaped electrode, comprising:
- a silicon ring body;
- and
- a cover body joined to at least a part of a surface of the ring body via a joining part, and having a better plasma resistance than silicon, wherein the joining part has a heat resistance to withstand a temperature of at least 150° C., melts at 700° C. or below, and contains boron oxide.
A ring-shaped electrode, comprising:
- a silicon ring body;
- and
- a cover body joined to at least a part of a surface of the ring body via a joining part, and having a better plasma resistance than silicon, wherein the joining part has a heat resistance to withstand a temperature of at least 150° C., melts at 700° C. or below, contains any of In, Sn, and Al, and is a eutectic alloy with silicon.
Dependencies are inferred from the claim text.