Laminated electronic component and circuit board for mounting the same

A mounting board mounting a laminated electronic component, comprising:

• a printed circuit board including first and second electrode pads disposed thereon;
• a laminated electronic component mounted on the printed circuit board;
• and
• a solder connecting the first and second electrode pads to the laminated electronic component,
• wherein the laminated electronic component comprises:
• a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body;
• and
• a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor,
• wherein a current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed,
• a plurality of internal electrodes of the first and second capacitors are arranged perpendicular to the lower surfaces of each of the first and second ceramic bodies,
• each of the plurality of internal electrodes of the first capacitor is disposed on the same plane with one of the plurality of internal electrodes of the second capacitor,
• the pluralities of internal electrodes of the first and second capacitors disposed on the same plane are electrically connected,
• each of the pluralities of internal electrodes of the first and second capacitors includes a plurality of first internal electrodes and a plurality of second internal electrodes,
• each of the plurality of first internal electrodes and each of the plurality of second internal electrodes of each of the first and second capacitors are respectively spaced apart from end surfaces of each of the first and second ceramic bodies in the length direction, and
• in a stacked combination of the first and second capacitors, substantial portions of the first to fourth external electrodes that are disposed between the first and second capacitors are respectively disposed on the upper surface of the first ceramic body with respect to the stacking direction of the first and second capacitors, and on the lower surface of the second ceramic body with respect to the stacking direction.