Embedded magnetic component device

An embedded magnetic component device comprising:

• an insulating substrate including:
• a base insulating substrate including a first side and second side opposite to the first side, and including a cavity therein, the cavity including a cavity floor and cavity side walls connected by the cavity floor;
• a first insulating layer including a plurality of layers, located on the first side of the base insulating substrate, and covering the cavity;
• and
• a second insulating layer located on the second side of the base insulating substrate;
• a magnetic core housed in the cavity;
• an adhesive material located between the cavity floor and the magnetic core;
• an air gap provided between the magnetic core and the insulating layer;
• a primary electrical winding passing through the base insulating substrate and located on the first and the second side of the base insulating substrate;
• a secondary electrical winding passing through the base insulating substrate, spaced away from the primary electrical winding so as to be isolated from the primary electrical winding, and located on the first and the second sides of the base insulating substrate;
• wherein
• the primary electrical winding includes:
• first upper conductive traces disposed on the first side of the base insulating substrate and covered by a layer of the plurality of layers of the first insulating layer;
• first lower conductive traces disposed on the second side of the base insulating substrate and covered by the second insulating layer;
• first inner conductive connectors disposed in the insulating substrate near an inner periphery of the magnetic core and providing an electrical connection between the first upper conductive traces and the first lower conductive traces;
• and
• first outer conductive connectors disposed in the insulating substrate near an outer periphery of the magnetic core and providing an electrical connection between the first upper conductive traces and the first lower conductive traces;
• the secondary electrical winding includes:
• second upper conductive traces disposed on the first side of the base insulating substrate and covered by the layer of the plurality of layers of the first insulating layer;
• second lower conductive traces disposed on the second side of the base insulating substrate and covered by the second insulating layer;
• second inner conductive connectors disposed in the insulating substrate near the inner periphery of the magnetic core and providing an electrical connection between the second upper conductive traces and the second lower conductive traces;
• and
• second outer conductive connectors disposed in the insulating substrate near the outer periphery of the magnetic core and providing an electrical connection between the second upper conductive traces and the second lower conductive traces;
• and
• the insulating substrate, the first insulating layer, and the second insulating layer are made of only the same materials.