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US 2019/0172483 A1Published application
Tape head having a portion of a bearing surface slot that defines a skiving edge
AssigneeInternational Business Machines Corporation
InventorsRobert G. Biskeborn, Calvin S. Lo
Life of this patent
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Abstract
A method according to one embodiment includes forming a bearing surface slot in an end of a section of a thin film wafer at a location that defines a tape bearing surface extending between the bearing surface slot and portions of transducers exposed on the end. The section has a plurality of rows of transducers formed on a substrate. A row is sliced from the section, the row having the end and bearing surface slot.
Claims14
A method, comprising:
- forming a bearing surface slot in an end of a section of a thin film wafer at a location that defines a tape bearing surface extending between the bearing surface slot and portions of transducers exposed on the end, the section having a plurality of rows of transducers formed on a substrate;
- and
- slicing a row from the section, the row having the end and bearing surface slot.
A method, comprising:
- coupling closures to a section of a thin film wafer having a plurality of rows of transducers formed on a substrate, the closures being coupled to the section on an opposite side of the transducers as the substrate;
- forming a bearing surface slot in an end of the section, a tape bearing surface being defined between the bearing surface slot and portions of the transducers exposed on the end;
- and
- slicing a row from the section, the row having the bearing surface slot;
- and
- removing, from the row or segment thereof, a portion of the end located on an opposite side of the bearing surface slot as the transducers.
3 more elements
Dependencies are inferred from the claim text.