US 2019/0171931 A1 · SYSTEMS AND METHODS FOR MACHINE LEARNING PROCESSOR WITH INTRA-DIE AND INTER-DIE WIRELESS COMMUNICATION

Abstract

The need for specialized machine learning processors has become a major focal point in the industry as the computation demanded by machine learning workloads grows rapidly. However, the industry has quickly come to a roadblock as the industry realizes, in the context of machine learning, the device memory is more important than complex computation ability. As a result, there has been renewed interest in three dimensional and “2.5D” machine learning processors, which are more suited to handle large volume of data. However, conventional multi-layer devices use through silicon vias (TSVs) which have a number of disadvantages and drawbacks. To address these issues, method and devices are disclosed that allow wireless communication between processing layers in a 3D and/or 2.5D integrated dice machine learning processors.

Claims20

Dependent claims

A machine learning processor optimized for carrying out machine learning operations, the processor comprising:

a substrate;
a plurality of processing dice on the substrate, wherein one or more of the plurality of the processing dice are substantially vertically stacked on one another and on the substrate and the processing dice comprise circuitry to carry out machine learning operations and one or more machine learning operations is carried out with circuitry on or embedded in two or more of the plurality of processing dice;
and
one or more wireless communication components embedded in and/or on one or more of the substrate and the plurality of processing dice, wherein the wireless communication components carry wireless communication signals between one or more of the substrate and the plurality of processing dice and the circuitry therein and wherein the operations of the machine learning processor comprises the communication signals.

1 more element

Dependencies are inferred from the claim text.

Systems and methods for machine learning processor with intra-die and inter-die wireless communication

Life of this patent

Systems and methods for machine learning processor with intra-die and inter-die wireless communication

Life of this patent

Abstract

Claims20