US 2019/0171857 A1 · SEMICONDUCTOR DEVICE AND FINGERPRINT SENSOR DEVICE THEREOF

Abstract

Embodiments of the disclosure relate to a semiconductor device. The semiconductor device includes a semiconductor substrate, a first metal wiring layer disposed on the semiconductor substrate, an interlayer dielectric layer (ILD) disposed on the first metal wiring layer, a second metal wiring layer disposed on the interlayer dielectric layer, and a first via and a second via disposed in the interlayer dielectric layer. The second via is on the first via, and there is not any metal wiring layer in the interlayer dielectric layer.

Claims17

Dependent claims

A semiconductor device, comprising:

a semiconductor substrate;
a first metal wiring layer disposed on the semiconductor substrate;
an interlayer dielectric layer disposed on the first metal wiring layer;
a second metal wiring layer disposed on the interlayer dielectric layer;
and
a first via and a second via disposed in the interlayer dielectric layer, wherein the second via is on the first via, and there is no conductive element except the first via and the second via in the interlayer dielectric layer.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/831,813Filed 5 Dec 2017

Published

6 Jun 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

G06V 40/1306
Sensors therefor: non-optical, e.g. ultrasonic or capacitive sensing
H10W 20/077
Of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers: on sidewalls or on…
H10W 20/081
Of dielectric parts thereof: by forming openings in the dielectric parts
H10W 72/073
Connecting or disconnecting: of die-attach connectors

Semiconductor device and fingerprint sensor device thereof

Life of this patent

Semiconductor device and fingerprint sensor device thereof

Life of this patent

Abstract

Claims17