Systems and methods for thermal management of multilayered integrated circuits
AssigneeVathys, Inc.
InventorTapabrata GHOSH
Life of this patent
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AssigneeVathys, Inc.
InventorTapabrata GHOSH
Estimating the term…
Thermal management in three dimensional integrated circuits can be difficult. Although three dimensional integrated circuits offer multiple benefits in alleviating back-end-of-the-line (BEOL) interconnect issues by reducing the wire length and reaping resistance-capacitance (RC) quadratic benefits, the thermal issues associated with stacking high performance (and subsequently high-power consumption) dice have so far proven to be prohibitive. Disclosed are methods and devices for efficient thermal management in multilayered ICs by determining thermally dangerous regions and selectively activating them to avoid undesirable temperature effects.
A method of thermal management in a multilayered integrated circuit (IC), comprising:
Non-transitory computer storage that stores executable program instructions that, when executed by one or more computing devices, configure the one or more computing devices to perform operations comprising:
Dependencies are inferred from the claim text.