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US 2019/0170885 A1Published application
Method of Making Semiconductor X-ray Detectors
AssigneeShenzhen Xpectvision Technology Co., Ltd.
InventorsPeiyan CAO, Yurun LIU
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Abstract
Disclosed herein is a method comprising: obtaining a substrate comprising an electronic system in or on the substrate, and a plurality of electric contacts on a first surface of the substrate, the electronic system being electrically connected to the electric contacts; obtaining a chip comprising an X-ray absorption layer, the X-ray absorption layer comprising an electrode; electrically connecting the electrode to at least one of the electric contacts by bonding the chip to the substrate; and thinning the substrate at a surface opposite the first surface.
Claims21
A method comprising:
- obtaining a substrate comprising an electronic system in or on the substrate, and a plurality of electric contacts on a first surface of the substrate, the electronic system being electrically connected to the electric contacts;
- obtaining a chip comprising an X-ray absorption layer, the X-ray absorption layer comprising an electrode;
- electrically connecting the electrode to at least one of the electric contacts by bonding the chip to the substrate;
- and
- thinning the substrate at a surface opposite the first surface.
2 more elements
Dependencies are inferred from the claim text.