High speed chip substrate test fixture

A multi-layer semiconductor substrate for high speed circuit testing, the multi-layer semiconductor substrate comprising:

• an upper construct layer;
• a lower construct layer;
• one or more intermediate construct layers interposed between the upper construct layer and the lower construct layer;
• a plurality of high-speed signal traces providing connections to an outer surface of the upper construct and an outer surface of the lower construct and passing through the one or more intermediate construct layers;
• one or more ground-return-vias or signal return vias connecting the upper construct layer and the adjacent intermediate construct layer;
• and
• one or more closed loop signal traces etched on the upper construct layer for minimizing electrical noise.

A system of for testing a high speed signal through a printer circuit board, the system comprising:

• a substrate;
• a transmission line disposed within the substrate;
• one or more connectors attached to the substrate for connecting one or more test cards;
• a lid, comprising one or more cutouts for the one or more connectors;
• a clamp for compressing the substrate against the lid;
• one or more high-speed connectors attached to the one or more test cards, respectively;
• and
• a signal analyzer connected to the one or more high speed connectors.