Bond Strength Testing Systems and Methods and Compression Wave Producing Devices for Use Therein
AssigneeThe Boeing Company
InventorsMark J. Clemen, JR., Alan F. Stewart, Dejan Nikic
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Abstract
A nondestructive bond strength testing method, including: coupling an expendable device to a structure under test, the expendable device including a patterned planar array of exploding bridge wires; simultaneously vaporizing the patterned planar array of exploding bridge wires by applying a pulse of electrical energy to the patterned planar array of exploding bridge wires; and sensing an initial disbonding signature of the structure under test.
Claims56
A nondestructive bond strength testing method, comprising:
- coupling an expendable device to a structure under test, the expendable device including a patterned planar array of exploding bridge wires;
- simultaneously vaporizing the patterned planar array of exploding bridge wires by applying a pulse of electrical energy to the patterned planar array of exploding bridge wires;
- and
- sensing an initial disbonding signature of the structure under test.
A nondestructive bond strength testing system, comprising:
- an expendable device for coupling to a structure under test, the expendable device including a patterned planar array of exploding bridge wires for producing a planar compression wave;
- a pulsed-power unit for applying a pulse of electrical energy to the patterned planar array of exploding bridge wires;
- and
- a disbond detecting sensor for sensing an initial disbonding signature of the structure under test.
An expendable device for producing a compression wave, comprising:
- a substrate;
- and
- a patterned planar array of exploding bridge wires formed on the substrate.
Dependencies are inferred from the claim text.