Adhesive with Tunable Porosity and Methods to Support Temporary Bonding Applications

An attach and release process using a temporary adhesive with tunable porosity to affix a work unit onto a carrier substrate, whereby subsequent to a manufacturing process, the porosity of the temporary adhesive allows the penetration of a liquid into the interfacial bond and releases the work unit without harm and without the need for a subsequent cleaning process by:

• adding a filler to a binder to create a temporary adhesive with an increased porosity where the ratio of filler to binder in the temporary adhesive is a ratio >1 and <5 on a weight basis;
• applying the temporary adhesive with tunable porosity between a work unit and a carrier substrate to affix the work unit to the carrier substrate;
• completing an electronics manufacturing process involving the work unit affixed to the carrier substrate;
• contacting the work unit affixed to the carrier substrate with a penetrating liquid which preferentially absorbs into the interfacial bond of the temporary adhesive with tunable porosity between the work unit and a carrier substrate;
• dissolving the binder contained by the temporary adhesive with tunable porosity and degrading the affixing properties between the work unit and the substrate carrier without harming the work unit;
• releasing the work unit from the carrier substrate without damage or a need for a further cleaning process to the work unit;
• wherein the fillers are at least 5-1000 microns in length, thickness or diameter and
• wherein the fillers comprise one or more from the group consisting of micro-fiber, micro-glass bead, micro-glass sphere, ceramic, cellulose, woven polyester, non-woven polyester, woven glass, non-woven glass, glass frit, ceramic frit, metal woven screen and metal non-woven screen;
• and wherein the binder comprises one or more from the group epoxy, acrylate, silicone, urethane, rubber, and engineering polymer.