Water Vapor-Blocking Adhesive Compound Having Highly Functionalized Poly(meth)acrylate

Abstract

The present invention relates to a curable adhesive compound for encapsulating an electronic or optoelectronic arrangement against permeates, made of the following components: (A) 20 to 99.9 wt % (relative to the total amount of the curable adhesive compound) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the range of at least 5,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one curing agent which can induce, thermally and/or by the application of UV radiation, the curing, in particular the cationic curing, of the (co)polymer (A) under reaction of its epoxy groups, (C) optionally 0 to 79.9 wt % of additional components.

Dependencies are inferred from the claim text.