US 2019/0169432 A1Published application

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high-speed communication-compatible module

AssigneeHitachi Chemical Company, Ltd.

InventorsShunsuke TONOUCHI, Tomokazu SHIMADA, Kazutoshi DANJOUBARA, Tomio FUKUDA, Minoru KAKITANI

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Abstract

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Claims14

Dependent claims

A thermosetting resin composition comprising:

(A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2),
(B) a thermoplastic elastomer, and
(C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Dependencies are inferred from the claim text.

Facts

Application: 16/305,930Filed 30 May 2017
Priority: JP 2016-1108682 Jun 2016
Published: 6 Jun 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification32 codes

C08L 79/02
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with…:…
B32B 5/02
Layered products characterised by the non- homogeneity or physical structure , i.e. comprising a fibrous, filamentary, particulate or foam…
B32B 5/28
One layer being a fibrous or filamentary layer: impregnated with or embedded in a plastic substance
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin

Family

US 10,876,000 B2Related patent
US 2019/0169432 A1This patent

From the US filing history. Foreign family members aren’t listed.

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