Curable particulate silicone composition, semiconductor member containing the same, and molding method thereof

Abstract

Provided are a curable particulate silicone composition having hot-melt properties, excellent handling workability and curing characteristics, high light reflectance in the visible wavelength region, and excellent flexibility and toughness at a temperature of from room temperature to a high temperature of about 250° C., and a pellet or the like formed by molding the composition. The curable particulate silicone composition comprises: (A) 100 parts by mass of hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) 100 to 4000 parts by mass of an inorganic filler; and (C) a curing agent. A cured product of the curable particulate silicone composition has an average linear expansion coefficient of 30 ppm/° C. or less at 25° C. to 200° C. and the ratio of the storage modulus at −50° C. to the storage modulus at 250° C. is 1/1 to 1/50.

Dependencies are inferred from the claim text.