Polishing apparatus and polishing method
AssigneeEbara Corporation
InventorsYuta SUZUKI, Taro TAKAHASHI
Life of this patent
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AssigneeEbara Corporation
InventorsYuta SUZUKI, Taro TAKAHASHI
Estimating the term…
A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current value of the swing shaft motor. While polishing the semiconductor wafer by causing the semiconductor wafer to swing around the swing center on the swing arm, a change of a frictional force between the polishing pad and the semiconductor wafer is detected by increasing a change amount of the first output.
A polishing apparatus for polishing between a polishing pad and a polishable object disposed opposed to the polishing pad, the polishing apparatus comprising:
A polishing method for polishing between a polishing pad and a polishable object disposed opposed to the polishing pad, the polishing method comprising:
A computer readable recording medium that records a program for causing a computer to control a polishing apparatus that can polish a polishable object, the polishing apparatus comprising:
Dependencies are inferred from the claim text.