Method for joining a substrate and a part with structuring of the substrate

A method of assembling a substrate with a part, the substrate having an upper surface and a lower surface, and the part having a surface, the method comprising:

• a) structuring the upper surface of the substrate by performing the following steps:
• i) providing the substrate;
• ii) providing a pulsed structuring laser capable of generating a pulsed structuring laser beam capable of engraving the upper surface of the substrate in a non-through manner, the pulsed structuring laser beam having a wavelength of between 200 and 11,000 nm, a sufficient power to create a structuring of the substrate, and having pulses of less than 1 μs in duration;
• iii) generating the pulsed structuring laser beam;
• iv) providing a displacement device capable of generating a relative motion between the pulsed structuring laser beam and the upper surface of the substrate;
• and
• v) irradiating the upper surface of the substrate with the pulsed structuring laser beam by inducing a relative motion between the pulsed structuring laser beam and the upper surface of the substrate to generate a first portion of structured upper surface of the substrate comprising a pattern;
• b) providing the part whose surface has a second surface portion comprising a fusible material having a melting point lower than the melting point of the first portion of structured upper surface of the substrate;
• c) placing the first portion of structured upper surface of the substrate in contact with the second surface portion of the part;
• d) applying a pressure so as to maintain contact between the first portion of structured upper surface of the substrate and the second surface portion of the part;
• e) providing a heating device capable of creating a temperature increase in the fusible material sufficient to melt the fusible material;
• and
• f) heating, by the heating device, the fusible material so as to reach a temperature sufficient to melt at least a portion of it in the pattern of the first portion of structured upper surface of the substrate.

A device for assembling a substrate with a part, the substrate having an upper surface and a lower surface, the part having a surface that has a second surface portion comprising a fusible material having a melting point lower than the melting point of the upper surface of the substrate, the device comprising:

• a pulsed structuring laser capable of generating a pulsed structuring laser beam capable of engraving the upper surface of the substrate in a non-through manner, the pulsed structuring laser beam having a wavelength of between 1,000 and 1,100 nm, a sufficient power to create a structuring of the substrate, and having pulses of less than 1 μs in duration;
• a displacement means capable of generating a relative motion between the pulsed structuring laser beam and the upper surface of the substrate;
• a contacting means for contacting the surface of the part with the upper surface of the substrate;
• a compression means;
• a heating device capable of creating a sufficient temperature increase in the fusible material to melt at least a portion of the fusible material,
• wherein the structuring laser and the displacement means are configured to impose on the laser beam a relative motion between the pulsed structuring laser beam and the upper surface of the substrate to generate a pattern formed by a plurality of grooves engraved on a first portion of the upper surface of the substrate,
• wherein the contacting means is configured to arrange the first portion of the upper surface of the substrate comprising the pattern in contact with the second surface portion of the part,
• wherein the compression means is configured to impose a compression force between the first portion of upper surface of the substrate comprising the pattern and the second surface portion of the part,
• wherein the heating device is configured to melt at least a fusible material portion of the part into the plurality of grooves of the pattern of the first portion of upper surface of the substrate, and
• wherein the fusible material of the part is capable of solidifying inside the grooves of the pattern of the substrate to create a junction between the part and the substrate forming an assembly comprising the part and the substrate.