US 2019/0154931 A1 · OPTICAL ASSEMBLIES, INTERCONNECTION SUBSTRATES AND METHODS FOR FORMING OPTICAL LINKS IN INTERCONNECTION SUBSTRATES

Abstract

Optical assemblies, interconnection substrates and methods of forming optical links are disclosed. In one embodiment, an optical assembly includes a first waveguide substrate, a second waveguide substrate, and an interconnection substrate having a first end face, a second end face, and a laser written waveguide. The first waveguide substrate is coupled to the first end face of the interconnection substrate, and the first waveguide is optically coupled to the laser written waveguide. The laser written waveguide terminates at the second end face of the interconnection substrate. The second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face.

Claims28

Dependent claims

An optical assembly comprising:

a first waveguide substrate comprising a first waveguide;
a second waveguide substrate comprising a second waveguide;
an interconnection substrate comprising a first end face, a second end face, and a laser written waveguide, wherein:
the first waveguide substrate is coupled to the first end face of the interconnection substrate;
the first waveguide is optically coupled to the laser written waveguide;
the laser written waveguide terminates at the second end face of the interconnection substrate;
and
the second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

16/253,024Filed 21 Jan 2019

Priority

29 Jul 2016

Published

23 May 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

G02B 6/4206
The coupling comprising intermediate optical elements, e.g. lenses, holograms: optical features
G02B 6/13
Of the integrated circuit kind: integrated optical circuits characterised by the manufacturing method
G02B 6/26
Coupling light guides: optical coupling means
G02B 6/4227
Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements: active alignment methods,…

Optical assemblies, interconnection substrates and methods for forming optical links in interconnection substrates

Life of this patent

Optical assemblies, interconnection substrates and methods for forming optical links in interconnection substrates

Life of this patent

Abstract

Claims28