Inertial sensor, method for manufacturing inertial sensor, inertial measurement unit, portable electronic apparatus, electronic apparatus, and vehicle
AssigneeSeiko Epson Corporation
InventorKoichiro KOMIZO
Life of this patent
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Abstract
A gyro sensor includes a plurality of beams connected via a turnaround part. A groove is provided on a main surface of at least one beam of the plurality of beams. Wall thicknesses on the main surface of two sidewalls facing each other of the groove in a direction orthogonal to a longitudinal direction of the beam satisfy 0.9≤T1/T2≤1.1, where T1 is the wall thickness of one sidewall and T2 is the wall thickness of the other sidewall.
Claims16
An inertial sensor comprising
- a plurality of beams connected via a turnaround part,
- wherein a groove is provided on a main surface of at least one beam of the plurality of beams,
- wall thicknesses on the main surface of two sidewalls facing each other of the groove in a direction orthogonal to a longitudinal direction of the beam satisfy
- 0.9≤T1/T2≤1.1,
- where T1 is the wall thickness of one sidewall and T2 is the wall thickness of the other sidewall.
A method for manufacturing an inertial sensor in which a plurality of sensor elements is arranged on a wafer, each sensor element including a plurality of beams connected via a turnaround part, with a groove provided on a main surface of at least one beam of the plurality of beams, the method comprising:
- deciding at least one of a number of the beams where the groove is to be formed and a length in a longitudinal direction of the groove, according to distribution of the sensor elements arranged within a surface of the wafer;
- and
- forming the groove in the beam, based on the decision.
Dependencies are inferred from the claim text.