US 2019/0153592 A1 · SHADOW RING FOR MODIFYING WAFER EDGE AND BEVEL DEPOSITION

Abstract

Embodiments of the invention contemplate a shadow ring that provides increased or decreased and more uniform deposition on the edge of a wafer. By removing material from the top and/or bottom surfaces of the shadow ring, increased edge deposition and bevel coverage can be realized. In one embodiment, the material on the bottom surface is reduced by providing a recessed slot on the bottom surface. By increasing the amount of material of the shadow ring, the edge deposition and bevel coverage is reduced. Another approach to adjusting the deposition at the edge of the wafer includes increasing or decreasing the inner diameter of the shadow ring. The material forming the shadow ring may also be varied to change the amount of deposition at the edge of the wafer.

Claims13

Dependent claims

A method of forming a shadow ring for use in a deposition chamber, the method comprising:

forming an annular body having a top surface and a bottom surface, the bottom surface including a first annular bottom surface and a second annular bottom surface, wherein the second annular bottom surface is disposed in a recessed slot located inwardly relative to the first annular bottom surface, the second annular bottom surface located a first distance above the first annular bottom surface;
forming at least one pin member extending from the first annular bottom surface;
and
forming an annular lip extending inwardly relative to the recessed slot and the first annular bottom surface, wherein the annular lip has a third annular bottom surface located a second distance above the first annular bottom surface, the second distance less than the first distance, and wherein the recessed slot is formed between the pin member and the annular lip.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

16/259,011Filed 28 Jan 2019

Priority

31 Dec 2009

Published

23 May 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

C23C 16/04
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical…
C23C 14/04
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material: coating on selected surface areas, e.g. using…
C23C 14/042
Coating on selected surface areas, e.g. using masks: using masks
C23C 16/042
Coating on selected surface areas, e.g. using masks: using masks

Family

Application61/291,680Us provisional application · filed 31 Dec 2009

Application12/974,365Division · filed 21 Dec 2010

Application16/259,011Division

US 10,227,695 B2Related patent

US 11,136,665 B2Related patent

US 2011/0159211 A1Published application

US 2019/0153592 A1This patent

From the US filing history. Foreign family members aren’t listed.

Shadow ring for modifying wafer edge and bevel deposition

Life of this patent

Shadow ring for modifying wafer edge and bevel deposition

Life of this patent

Abstract

Claims13