Ruthenium metal feature fill for interconnects

A method for ruthenium (Ru) metal filling, the method comprising:

• providing a substrate containing features in a substrate;
• depositing a Ru metal layer in the features, wherein depositing the Ru metal layer pinches off the feature openings before the features are filled with the Ru metal layer, thereby forming voids inside the features;
• removing excess Ru metal that caused the pinch-off, wherein the removing removes the Ru metal layer from a field area around an opening of the features;
• and
• depositing additional Ru metal in the features, wherein the additional Ru metal is deposited in the features at a higher rate than on the field area.