Probes for wafer sorting

A method for making a probe for wafer sorting or die testing, comprising:

• providing a probe wire, wherein the probe wire includes a probe core and a probe plating layer around the probe core, the probe core includes a first material, the probe plating layer includes a second material, and the probe wire has a top part and a probe body;
• forging a probe tip at the top part of the probe wire, wherein the probe tip includes the first material, the probe tip is next to the probe core of the probe body, and an end surface of the probe tip is substantially flat and is smaller than a surface of the probe core;
• clipping away undesired material from the probe tip;
• and
• cleaning to remove materials accumulated during the forging the probe tip and the clipping away the undesired material.

A probe-manufacturing device, comprising:

• a forging unit to forge a probe tip at a top part of a probe wire, wherein the probe wire includes a probe core and a probe plating layer around the probe core, the probe core includes a first material, the probe plating layer includes a second material, and the probe wire has the top part and a probe body;
• a clipping unit to clip away undesired material from the probe tip;
• and
• an actuation mechanism to control the forging unit and the clipping unit.