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US 2019/0099856 A1Published application
Polishing pad, method for manufacturing polishing pad, and polishing method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Hao HUANG, Hsuan-Pang LIU, Yuan-Chun SIE, Pinyen LIN, Cheng-Chung CHIEN
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Abstract
A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.
Claims20
A method for manufacturing a polishing pad, comprising:
- forming a polishing layer having a top surface, wherein the forming the polishing layer comprises defining a first cavity;
- and
- bonding the polishing layer onto a support layer defining a recess such that the first cavity overlies the recess, wherein the top surface of the polishing layer faces away from the support layer after the bonding and the first cavity is buried beneath the top surface of the polishing layer after the bonding.
A method for manufacturing a polishing pad, comprising:
- forming a polishing layer having a top surface and a bottom surface, wherein the forming the polishing layer comprises defining a plurality of first cavities disposed between the top surface of the polishing layer and the bottom surface of the polishing layer such that two adjacent cavities of the plurality of first cavities have a uniform height measured between the top surface of the polishing layer and the bottom surface of the polishing layer and such that a solid portion is disposed between the top surface of the polishing layer and a cavity of the plurality of first cavities;
- and
- bonding the polishing layer onto a support layer, wherein the top surface of the polishing layer faces away from the support layer.
A polishing method, comprising:
- dispensing slurry onto a polishing pad, wherein the polishing pad defines an open cavity and a buried cavity, and the dispensing the slurry dispenses at least a portion of the slurry into the open cavity;
- holding a workpiece against the polishing pad;
- and
- rotating the workpiece relative to the polishing pad, wherein the polishing pad is worn to expose the buried cavity during the rotating.
1 more element
Dependencies are inferred from the claim text.