Method for processing sputtering target and method for manufacturing sputtering target product
AssigneeSumitomo Chemical Company, Limited
InventorMasahiro FUJITA
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AssigneeSumitomo Chemical Company, Limited
InventorMasahiro FUJITA
Estimating the term…
Disclosed is a method for processing a sputtering target comprises: processing a sputtering target by rotating a cutting tool which has a blade portion with an arc-shaped concave curved surface on a cross section along the axis, around an axis thereof, to chamfer the target at a corner portion between a sputtering surface and a side surface in the sputtering target with an arc-shaped concave curved surface of a blade portion in such a manner that the corner portion is approximated to an arc-shaped aimed R face, wherein the sputtering target is chamfered at the corner portion in such a manner that a curvature radius Ra of the concave curved surface in the blade portion is equal to or more than a curvature radius Rb of the aimed R face on the cross section along the axis and that both ends of the concave curved surface in the blade portion are positioned away from the sputtering target.
A method for processing a sputtering target comprising:
(canceled)
A method for processing a sputtering target, comprising:
(canceled)
A method for processing a sputtering target comprising:
A method for processing a sputtering target, comprising:
Dependencies are inferred from the claim text.