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US 2019/0096944 A1Published application
Solid-state image pickup device and manufacturing method of the same
AssigneeSharp Kabushiki Kaisha
InventorsFUMINORI OKADA, OSAMU YANAGIDA
Life of this patent
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Abstract
First bumps and second bumps are arranged on a substrate. Top surfaces in a desired positional relationship are formed by pressing the bumps by a pressing member at the same time. An image pickup element is bonded to the first bumps and a sensor cover is bonded to the second bumps.
Claims11
A manufacturing method of a solid-state image pickup device, the manufacturing method comprising:
- a first process of arranging first bumps in positions on a substrate for supporting an image pickup element and arranging second bumps in positions on the substrate for supporting an optical element support member for supporting an optical element on an optical axis of the image pickup element;
- a second process of forming top surfaces on the first bumps and the second bumps by pressing the first bumps and the second bumps from above by a pressing member having a surface shape according to a relative positional relationship between the image pickup element and the optical element support member, where the optical element is supported on an optical axis of the image pickup element;
- a third process of mounting the image pickup element over the substrate by bonding the image pickup element to the first bumps;
- and
- a fourth process of bonding the optical element support member to the second bumps.
2 more elements
A solid-state image pickup device comprising:
- a substrate;
- a plurality of first bumps and a plurality of second bumps, which are arranged on the substrate;
- an image pickup element mounted over the substrate by being bonded to the first bumps;
- and
- an optical element support member which is bonded to the second bumps and covers the image pickup element,
- wherein each of the first bumps and the second bumps has a top surface formed by being pressed by a pressing member at the same time.
3 more elements
Dependencies are inferred from the claim text.