Ultraviolet light receiving element and method of manufacturing ultraviolet light receiving element

An ultraviolet light receiving element, comprising:

• a first photodiode sensitive to the ultraviolet light provided in a first region of a semiconductor substrate, and including a first well implantation layer of a first conductivity type, a first embedded implantation layer of a second conductivity type, and a first surface implantation layer of the first conductivity type, the first embedded implantation layer being formed in the first well implantation layer, the first surface implantation layer being formed in a surface of the semiconductor substrate in the first embedded implantation layer;
• and
• a second photodiode insensitive to the ultraviolet light provided in a second region of the semiconductor substrate, and including a second well implantation layer of the first conductivity type, a second embedded implantation layer of the second conductivity type, and a second surface implantation layer of the first conductivity type, the second embedded implantation layer being formed in the second well implantation layer, the second surface implantation layer being formed in the surface of the semiconductor substrate in the second embedded implantation layer,
• the second well implantation layer having a peak concentration position deeper than the peak concentration position of the first well implantation layer by a depth dp which is calculated by the following expression:
• dp≈ds exp(αxp)
• where ds is a depth from the surface of the semiconductor substrate to a peak concentration position of the second surface implantation layer, xp is a depth from the surface of the semiconductor substrate to a peak concentration position of the first well implantation layer, α is a light absorption coefficient in the semiconductor substrate, and αxp is not regarded as zero.

A method of manufacturing an ultraviolet light receiving element, comprising:

• forming, in a first region of a semiconductor substrate of a first conductivity type, a first photodiode sensitive to the ultraviolet light including a first well implantation layer of a second conductivity type, a first embedded implantation layer of the first conductivity type, and a first surface implantation layer of the second conductivity type, the first embedded implantation layer being formed in the first well implantation layer, the first surface implantation layer being formed in a surface of the semiconductor substrate in the first embedded implantation layer;
• and
• forming, in a second region of the semiconductor substrate, a second photodiode insensitive to the ultraviolet light including a second well implantation layer of the second conductivity type, a second embedded implantation layer of the first conductivity type, and a second surface implantation layer of the second conductivity type, the second embedded implantation layer being formed in the second well implantation layer, the second surface implantation layer being formed in the surface of the semiconductor substrate in the second embedded implantation layer,
• the second well implantation layer being formed so as to have a peak concentration position deeper than a peak concentration position of the first well implantation layer by a depth equal to a depth from the surface of the semiconductor substrate to a peak concentration position of the second surface implantation layer.

A method of manufacturing an ultraviolet light receiving element, comprising:

• forming, in a first region of a semiconductor substrate of a first conductivity type, a first photodiode sensitive to an ultraviolet light including a first well implantation layer of a second conductivity type, a first embedded implantation layer of the first conductivity type, and a first surface implantation layer of the second conductivity type, the first embedded implantation layer being formed in the first well implantation layer, the first surface implantation layer being formed in a surface of the semiconductor substrate in the first embedded implantation layer;
• and
• forming, in a second region of the semiconductor substrate, a second photodiode insensitive to the ultraviolet light including a second well implantation layer of the second conductivity type, a second embedded implantation layer of the first conductivity type, and a second surface implantation layer of the second conductivity type, the second embedded implantation layer being formed in the second well implantation layer, the second surface implantation layer being formed in the surface of the semiconductor substrate in the second embedded implantation layer,
• the second well implantation layer being formed so as to have a peak concentration position deeper than the peak concentration position of the first well implantation layer by a depth dp which is calculated by the following expression:
• dp≈ds exp(αx p)
• where ds is a depth from the surface of the semiconductor substrate to a peak concentration position of the second surface implantation layer, xp is a depth from the surface of the semiconductor substrate to a peak concentration position of the first well implantation layer, α is a light absorption coefficient in the semiconductor substrate, and αxp is not regarded as zero.