Semiconductor Packages and Methods of Forming Same

A package comprising:

• a first package structure comprising:
• a dummy die having a front-side and a back-side;
• a first integrated circuit die having a front-side and a back-side, the front-side comprising die connectors;
• a first attaching layer between and contacting the back-side of the first integrated circuit die and front-side of the dummy die;
• a first electrical connector adjacent the first integrated circuit die, the first attaching layer, and the dummy die;
• an encapsulant laterally encapsulating the first integrated circuit die, the dummy die, the first attaching layer, and the first electrical connector;
• a first redistribution structure on and electrically connected to the die connectors of the first integrated circuit die and the first electrical connector;
• and
• thermal elements on the back-side of the dummy die;
• and
• a second package structure bonded to the first electrical connector and the thermal elements with a first set of conductive connectors.

A structure comprising:

• a first package structure comprising:
• a first redistribution structure comprising metallization patterns and dielectric layers;
• a first die over and electrically connected to the first redistribution structure, an active side of the first die comprising die connectors facing the first redistribution structure;
• a first through via adjacent the first die, the first through via electrically connected to the first redistribution structure;
• an encapsulant laterally encapsulating the first die and the through via;
• an attaching layer over a back-side of the first die, the back-side of the first die being opposite the active side, the attaching layer contacting the encapsulant;
• and
• a second redistribution structure over the attaching layer and the first through via, the second redistribution structure comprising metallization patterns and a dielectric layer, the second redistribution structure being electrically connected to the first through via;
• and
• a second package structure bonded to the metallization patterns of the second redistribution structure with a first set of conductive connectors.