Semiconductor device and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Hui YANG, Chun-Ting LIAO, Yi-Te CHEN, Chen-Yuan CHEN, Ho-Chun LIOU
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Abstract
A method of manufacturing a semiconductor device comprises forming an integrated circuit, surrounding the integrated circuit with an inner seal ring, and surrounding the inner seal ring with a closed-loop outer seal ring. The inner seal ring includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- forming an integrated circuit;
- surrounding the integrated circuit with an inner seal ring that includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other;
- and
- surrounding the inner seal ring with a closed-loop outer seal ring.
A method of manufacturing a semiconductor device, the method comprising:
- forming an integrated circuit;
- and
- surrounding the integrated circuit with a first seal ring including
- a plurality of metal layers in a stacked configuration, and
- a plurality of seal portions that are separated from each other and that surround first and second corners of a boundary between the first seal ring and the integrated circuit.
A method for manufacturing a semiconductor device comprising:
- forming an integrated circuit over a substrate;
- surrounding the integrated circuit with an inner seal ring that has spaced apart first, second, third, and fourth seal portions, wherein surrounding the integrated circuit with the inner seal ring is simultaneous with forming the integrated circuit;
- and
- surrounding the inner seal ring with a closed-loop outer seal ring.
Dependencies are inferred from the claim text.