US 2019/0096821 A1 · MANUFACTURING METHOD OF PACKAGE STRUCTURE

Abstract

A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive connector is formed aside the first conductive connectors and electrically insulated to the die. A redistribution layer is formed on the die. The redistribution layer is electrically connected to the first conductive connectors and the second conductive connector. A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield. Another manufacturing method of a package structure is also provided.

Claims20

Dependent claims

A manufacturing method of a package structure, comprising:

forming a plurality of first conductive connectors and a second conductive connector on an active surface of a die, wherein the first conductive connectors are electrically connected to the die, the second conductive connector is formed aside the first conductive connectors and is electrically insulated from the die;
forming a redistribution layer on the die, wherein the redistribution layer is electrically connected to the first conductive connectors and the second conductive connector;
and
forming a conductive shield on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die, wherein a portion of the conductive shield is formed between the active surface of the die and the redistribution layer, and the die is electrically insulated from the conductive shield.

1 more element

A manufacturing method of a package structure, comprising:

providing a wafer, wherein the wafer comprises a plurality of first regions and a plurality of second regions, each of the second regions is connected to one of the first regions, respectively, the second regions are electrically insulated;
disposing a plurality of conductive connectors on the first regions and the second regions of the wafer;
forming a redistribution layer on the conductive connectors to electrically connect the conductive connectors;
removing a portion of the wafer to form a plurality of dies, wherein each of the dies comprises one of the first regions and one of the second regions, the dies are electrically connected to the redistribution layer through the conductive connectors corresponding to the first regions;
forming a conductive shield on the redistribution layer to surround the conductive connectors on the second regions and cover the dies, wherein a portion of the conductive shield is formed between an active surface of each of the dies and the redistribution layer, and the conductive shield is electrically insulated from the dies;
and
performing a singulation process to form a package structure.

4 more elements

Dependencies are inferred from the claim text.

Manufacturing method of package structure

Life of this patent

Manufacturing method of package structure

Life of this patent

Abstract

Claims20