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US 2019/0096792 A1Published application
Wiring substrate device
AssigneeShinko Electric Industries Co., Ltd.
InventorTatsuya Koike
Life of this patent
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Abstract
A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.
Claims7
A wiring substrate device comprising:
- a wiring substrate;
- a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end;
- and
- a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.
1 more element
Dependencies are inferred from the claim text.