Integrated fan-out packages and methods of forming the same

An integrated fan-out package, comprising:

• a first semiconductor chip comprising a heat dissipation layer on a first surface thereof;
• a plurality of through integrated fan-out vias aside the first semiconductor chip;
• a redistribution layer structure over the first semiconductor chip and thermally connected to the heat dissipation layer;
• at least one thermal via between and in physical contact with the redistribution layer structure and the heat dissipation layer of the first semiconductor chip;
• an encapsulation layer encapsulating the plurality of through integrated fan-out vias and the least one thermal via;
• and
• a second semiconductor chip over the redistribution layer structure and electrically connected to the first semiconductor chip.

A method of forming an integrated fan-out package, comprising:

• forming a plurality of through integrated fan-out vias over a first redistribution layer structure;
• placing a first semiconductor chip over the first redistribution layer structure, wherein the first semiconductor chip comprises at least one connector and a heat dissipation layer on opposite surfaces thereof, and the at least one connector faces the first redistribution layer structure;
• encapsulating the first semiconductor chip and the plurality of through integrated fan-out vias with an encapsulation layer;
• and
• forming a second redistribution layer structure over the first semiconductor chip, wherein the second redistribution layer structure is thermally connected to the heat dissipation layer of the first semiconductor chip.