Conformable heat spreader
AssigneeIntel Corporation
InventorsJoe Walczyk, John C. Johnson
Life of this patent
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AssigneeIntel Corporation
InventorsJoe Walczyk, John C. Johnson
Estimating the term…
A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.
A heat spreader, comprising:
A heat spreading system, comprising:
A method for dissipating heat in electronic devices, comprising:
Dependencies are inferred from the claim text.