Method for aligning chip components relative to substrate by using liquid

A method for aligning a chip component relative to a substrate by using a liquid, comprising:

• supplying a liquid remaining in a liquid state under a temperature environment lower than 100 degrees C. to the substrate;
• and
• arranging the chip component on the liquid,
• wherein the substrate includes a first surface in which a mounting region having a rectangular shape extending to have a long length in one direction is formed,
• the chip component includes a second surface facing the mounting region in the arranging the chip component,
• wherein the second surface has a rectangular shape which substantially coincides with the shape of the mounting region and has an area substantially equal to an area of the mounting region,
• the mounting region includes a first region and a second region other than the first region in the mounting region,
• a wettability of the first region with respect to the liquid is higher than a wettability of the second region with respect to the liquid,
• the first region is provided symmetrically with respect to a first central line orthogonal to a long side of the mounting region and provided symmetrically with respect to a second central line orthogonal to a short side of the mounting region, the first region including a plurality of partial regions each having a rectangular shape, and
• wherein the supplying a liquid includes supplying the liquid to the first region.