Heat Shield for Chamber Door and Devices Manufactured Using Same

A method comprising:

• placing within a load lock module a substrate, the substrate having thereon a region with a first pattern density and a second region having low pattern density relative first pattern density;
• moving the substrate from the load lock module to a first process chamber by passing the substrate through a chamber door;
• closing the chamber door;
• heating the chamber door;
• and
• performing a temperature-dependent process on the substrate, and maintaining temperature uniformity across the substrate during the temperature-dependent process by thermally insulating the substrate from the heated chamber door.

A method comprising:

• forming on a substrate a first plurality of fins having a first spatial density and being respectively insulated from one another by an insulating layer;
• forming on the substrate a second plurality of fins having a second spatial density, the second spatial density being less than the first spatial density, the second plurality of fins being respectively insulated from one another by the insulating layer;
• placing the substrate containing the first plurality of fins and second plurality of fins into a chamber by passing the substrate through a chamber door;
• closing the chamber door;
• heating the chamber door;
• and
• performing on the substrate a temperature-dependent process while thermally insulating the substrate from the heated chamber door.