Self-aligned build-up of topographic features
AssigneeIntel Corporation
InventorsLeonard P. Guler, Nick Lindert
Life of this patent
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AssigneeIntel Corporation
InventorsLeonard P. Guler, Nick Lindert
Estimating the term…
Methods and architectures for self-aligned build-up of patterned features. An initial patterned feature aspect ratio may be maintained or increased, for example to mitigate erosion of the feature during one or more subtractive device fabrication processes. A patterned feature height may be increased without altering an effective spacing between adjacent features that may be further relied upon, for example to further pattern an underlying material. A patterned feature may be conformally capped with a material, such as a metal or dielectric, in a self-aligned manner, for example to form a functional device layer on an initial pattern having a suitable space width-to-line height aspect ratio without the use of a masked etch to define the cap.
1-20. (canceled)
A nanofabrication method, comprising:
A method of fabricating a transistor, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.