Novel approach for ultra thin-film transfer and handling
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPing-Yin Liu, Chang-Ming Wu, Chia-Shiung Tsai, Xin-Hua Huang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPing-Yin Liu, Chang-Ming Wu, Chia-Shiung Tsai, Xin-Hua Huang
Estimating the term…
A method for forming a pellicle apparatus involves forming a device substrate by depositing one or more pellicle layers defined over a base device layer, where a release layer is formed thereover. An adhesive layer is formed over a transparent carrier substrate. The adhesive layer is bonded to the release layer, defining a composite substrate comprised of the device and carrier substrates. The base device layer is removed from the composite structure and a pellicle frame is attached to an outermost one of the pellicle layers. A pellicle region is isolated from a remainder of the composite structure, and an ablation of the release layer is performed through the transparent carrier substrate, defining the pellicle apparatus comprising a pellicle film attached to the pellicle frame. The pellicle apparatus is then from a remaining portion of the composite substrate.
An extreme ultraviolet (EUV) pellicle apparatus, comprising:
A method for forming a pellicle apparatus, the method comprising:
An extreme ultraviolet (EUV) lithography system, comprising:
Dependencies are inferred from the claim text.