Adhesive sheet for molding stage
AssigneeNitto Denko Corporation
InventorsYoshiko OGINO, Yutaka TOSAKI, Michiro KAWANISHI
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AssigneeNitto Denko Corporation
InventorsYoshiko OGINO, Yutaka TOSAKI, Michiro KAWANISHI
Estimating the term…
A pressure-sensitive adhesive sheet (X1), which is a pressure-sensitive adhesive sheet for build stage use according to the present invention, has a multilayer structure typically including a substrate (11) and a pressure-sensitive adhesive layer (12). The pressure-sensitive adhesive sheet (X1) has a puncture strength of 3.3 to 12 N, where the puncture strength is determined as a maximum load during a process in which a probe having a hemispherical head with the radius of curvature of 0.5 mm pierces the pressure-sensitive adhesive sheet at a travel speed of 0.2 mm/s. The pressure-sensitive adhesive sheet for build stage use is suitable for detachment of an object, which is formed on a build stage typically of an additive manufacturing apparatus, from the build stage while less causing the significant damage to the object.
A pressure-sensitive adhesive sheet for build stage use, the pressure-sensitive adhesive sheet having a multilayer structure comprising:
A pressure-sensitive adhesive sheet for build stage use, the pressure-sensitive adhesive sheet having a multilayer structure comprising:
Dependencies are inferred from the claim text.