US 2019/0059163 A1 · A METHOD OF THERMAL DECOUPLING OF PRINTED CIRCUITS AND A PRINTED CIRCUIT FOR USE THEREIN

Abstract

In order to counter heat propagation between adjacent sections of a ribbon-like printed circuit board, the sections being individually exposed to heat between opposed border lines, with printed circuit board including an electrically insulating substrate with electrically conductive pads for mounting components thereon, the adjacent sections are terminated at the opposed border lines with at least one electrically conductive borderline pad, which has a separation gap to the border line, and/or is coupled to an electrically conductive line extending on substrate between a first end at borderline pad and a second end away from borderline pad. The first end and the second end may be located at a first and at a second distances to border line, the second distance being longer than the first distance, and/or the electrically conductive line may have a narrower cross section than the first and the second ends.

Claims10

Dependent claims

A method of countering heat propagation between adjacent sections of a ribbon-like printed circuit board with said sections individually exposed to heat between opposed border lines, wherein said printed circuit board includes an electrically insulating substrate with electrically conductive pads for mounting components thereon,

the method comprising terminating said adjacent sections at said opposed border lines with at least one electrically conductive borderline pad, wherein said at least one borderline pad:
has a separation gap to the border line, and/or
is coupled to an electrically conductive line extending on said substrate between a first end at said at least one borderline pad and a second end away from said at least one borderline pad, said first end and said second end having respective first and second distances to the border line, with said second distance longer than said first distance, and/or
is coupled to an electrically conductive line extending on said substrate between a first end at said at least one borderline pad and a second end away from said at least one borderline pad, wherein said electrically conductive line has a narrower cross section than said first and second ends.

1 more element

A ribbon-like printed circuit board including adjacent sections to be individually exposed to heat between opposed border lines, wherein said printed circuit board comprising an electrically insulating substrate with electrically conductive pads for mounting components thereon, wherein said adjacent sections terminate at said opposed border lines with at least one electrically conductive borderline pad wherein said at least one borderline pad:

has a separation gap to the border line, and/or
is coupled to an electrically conductive line extending on said substrate between a first end at said at least one borderline pad and a second end away from said at least one borderline pad, said first end and said second end having respective first and second distances to the border line, with said second distance longer than said first distance, and/or
is coupled to an electrically conductive line extending on said substrate between a first end at said at least one borderline pad and a second end away from said at least one borderline pad, wherein said electrically conductive line has a narrower cross section than said first and second ends.

Dependencies are inferred from the claim text.

A method of thermal decoupling of printed circuits and a printed circuit for use therein

Life of this patent

A method of thermal decoupling of printed circuits and a printed circuit for use therein

Life of this patent

Abstract

Claims10