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US 2019/0058125 A1Published application
Composition for organic electronic element encapsulant, and encapsulant formed by using same
AssigneeMomentive Performance Materials Korea Co., Ltd.
InventorsSun Yu, Hyun-Sang Choi, Nan Soo Kim
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Abstract
A composition for an encapsulant according to one embodiment of the present application comprises 1) a silicone resin, 2) one or more types of moisture absorbent, 3) one or more types of photoinitiator, 4) one or more types of fillers, and 5) a reactive silicone oligomer.
Claims13
A composition for an encapsulant, comprising:
- 1) a silicone resin;
- 2) one or more moisture absorbents;
- 3) one or more photoinitiators;
- 4) one or more fillers;
- and
- 5) a reactive silicone oligomer.
3 more elements
Dependencies are inferred from the claim text.