Array substrate and method of fabricating the same

An array substrate, comprising:

• a base substrate,
• a first electrode on the base substrate,
• a first protection layer on the first electrode distal to the base substrate,
• a semiconductor electrode at a side of the first protection layer distal to the first electrode and whose projection on the base substrate at least partially overlaps a projection of the first electrode on the base substrate,
• a second protection layer at a side of the semiconductor electrode distal to the first protection layer, and
• a second electrode at a side of the second protection layer distal to the second protection layer and whose projection on the base substrate at least partially overlaps the projection of the semiconductor electrode on the base substrate,
• wherein the first electrode is configured to make the semiconductor electrode conductive by applying a voltage signal, and in a direction perpendicular to the base substrate, a thickness of at least a portion of the first protection layer in a first electrode area is less than a thickness of other portions of the first protection layer outside the first electrode area, the first electrode area being an area defined by a projection of the first electrode on the first protection layer.

A method of fabricating an array substrate, comprising:

• forming a pattern of a first electrode on a base substrate by using a single mask;
• forming, by using a single mask, a pattern of a first protection layer on the first electrode distal to the base substrate;
• forming, by using a single mask, a recess portion recessed towards the base substrate on a surface of the first protection layer distal to the first electrode;
• and
• forming a pattern of a semiconductor electrode at a side of the first protection layer distal to the first electrode, wherein the semiconductor electrode has a portion formed within the recess portion.