Semiconductor device manufacturing method and soldering support jig
AssigneeFuji Electric Co., Ltd.
InventorsRikihiro MARUYAMA, Kenshi KAI, Kazuya ADACHI
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Abstract
A semiconductor device manufacturing method includes: applying solder to an arrangement area of a substrate, the substrate having a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area; arranging a component on the arrangement area via the solder; and soldering the component to the arrangement area by heating the solder while covering the connection area. A soldering support jig includes a columnar covering member having a covering surface at a bottom of the columnar covering member.
Claims17
A semiconductor device manufacturing method comprising:
- applying solder to an arrangement area of a substrate, the substrate having a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area;
- arranging a component on the arrangement area via the solder;
- and
- soldering the component to the arrangement area by heating the solder while covering the connection area.
A soldering support jig comprising:
- a columnar covering member having a covering surface at a bottom of the columnar covering member, wherein
- the soldering support jig is used for a substrate, the substrate having an arrangement area on which a component is to be arranged and a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area, and
- the covering surface of the soldering support jig is formed to correspond to the connection area.
Dependencies are inferred from the claim text.