Semiconductor packages

A semiconductor package comprising:

• a mold substrate having opposite first and second surfaces;
• a semiconductor chip embedded inside the mold substrate, the semiconductor chip including chip pads;
• a redistribution layer on the first surface of the mold substrate, the redistribution layer including redistribution lines therein electrically connected to the chip pads and including a capacitor redistribution line;
• and
• a capacitor comprising:
• a first electrode including a plurality of conductive pillars connected to the capacitor redistribution line;
• a dielectric layer on the first electrode;
• and
• a second electrode on the dielectric layer;
• wherein the redistribution lines include a first conductive material, and
• the plurality of conductive pillars include a second conductive material different from the first conductive material.