Integrated shield package and method

An integrated shield electronic component package comprising:

• a substrate comprising a first surface, a second surface, and sides extending between the first surface and the second surface;
• terminals coupled to the second surface;
• interconnection structures coupled to the terminals of the second surface;
• and
• an integrated shield of uniform thickness coupled to the first surface of the substrate and comprising a side shielding portion fully covering the sides of the substrate;
• wherein there is no solder material at any portion of:
• a first side area between a first side of the substrate and a corresponding first side shielding portion of the integrated shield that faces the first side of the substrate;
• and
• a second side area between a second side of the substrate and a corresponding second side shielding portion of the integrated shield that faces the second side of the substrate.

A packaged electronic component comprising:

• a substrate comprising a first surface having a shield-attach terminal, a second surface, and sides extending between the first surface and the second surface;
• an electronic component coupled to first terminals of the first surface;
• interconnection structures coupled to second terminals of the second surface;
• and
• an integrated shield of uniform thickness coupled to the first surface of the substrate and comprising a side shielding portion fully covering the sides of the substrate;
• wherein there is no solder material at any portion of:
• a first side area between a first side of the substrate and a corresponding first side shielding portion of the integrated shield that faces the first side of the substrate;
• and
• a second side area between a second side of the substrate and a corresponding second side shielding portion of the integrated shield that faces the second side of the substrate.

A method of fabricating an integrated shield electronic component package, the method comprising:

• applying an integrated shield of uniform thickness to a first surface of a substrate comprising the first surface, a second surface, and sides extending between the first surface and the second surface such that a side shielding portion of the integrated shield fully covers the sides of the substrate;
• and
• coupling interconnection structures to terminals coupled to the second surface;
• wherein said coupling the integrated shield couples the integrated shield to the first surface such that there is no solder material at any portion of:
• a first side area between a first side of the substrate and a corresponding first side shielding portion of the integrated shield that faces the first side of the substrate;
• and
• a second side area between a second side of the substrate and a corresponding second side shielding portion of the integrated shield that faces the second side of the substrate.