Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device comprising:

• forming a first photoresist film over a substrate;
• exposing a first pattern including an alignment pattern on the first photoresist film in a first region of the substrate;
• forming, on the substrate, an alignment mark corresponding to the alignment pattern of the first pattern exposed on the first photoresist film;
• forming a second photoresist film over the substrate on which the alignment mark is formed;
• dividing a second pattern into a plurality of regions and exposing the divided regions separately on the second photoresist film in a second region on the substrate while performing positioning with respect to the alignment mark;
• and
• developing the second photoresist film and forming the second photoresist film having the second pattern,
• wherein at least a part of the second region is located outside an effective exposure region of an exposure apparatus in exposure of the first pattern.