Transmissive composite film for application to the backside of a microelectronic device
AssigneeIntel Corporation
InventorsMohit GUPTA, Mukul RENAVIKAR
Life of this patent
Estimating the term…
Abstract
A transmissive composite film is described that may be applied to the backside of a microelectronic device, for example an integrated circuit die or a bridge. A microelectronic die package in one example has a substrate, an integrated circuit die attached and electrically connected to the substrate, the die having a front side with electrical attachments and a backside, and a composite film attached to a backside of the die, the composite film having a polymer base with nano-fillers to protect the backside of the die.
Claims21
-20. (canceled)
A microelectronic die package comprising:
- a substrate;
- an integrated circuit die attached and electrically connected to the substrate, the die having a front side with electrical attachments and a backside;
- and
- a composite film attached to a backside of the die, the composite film having a polymer base with nano-fillers to protect the backside of the die.
A method comprising:
- attaching a dicing tape to a back side of a wafer, the dicing tape having an composite film between an adhesive and the wafer, the composite film having a polymer base with nano-fillers to protect the back side of the wafer;
- dicing the wafer into singulated dies after attaching the dicing tape;
- removing the dicing tape without removing the composite film;
- inspecting the dies through the composite film;
- and
- packaging the dies without removing the composite film.
A computing system comprising;
- a system board;
- a memory attached to the system board;
- and
- a processor package attached to a substrate, the processor package having a processor die attached and electrically connected to the substrate, the die having a front side with electrical attachments and a backside, and a composite film attached to a backside of the die, the composite film having a polymer base with nano-fillers to protect the backside of the die.
Dependencies are inferred from the claim text.