Through-mold openings for dual-sided packaged modules with ball grid arrays

A method for manufacturing a dual-sided module, the method comprising:

• providing or forming a packaging substrate having an upper side, a lower side, and a ground plane;
• implementing a radio-frequency circuit assembly on both of the upper and lower sides of the packaging substrate;
• forming an upper overmold on the upper side of the packaging substrate to cover an upper portion of the radio-frequency circuit assembly;
• forming one or more openings through the upper overmold to expose one or more contact pads on the upper side of the packaging substrate, the one or more contact pads in electrical connection with the ground plane;
• covering an upper surface and the one or more openings of the upper overmold with a conductive layer to be in electrical contact with the ground plane to thereby provide shielding for a region on the upper side of the packaging substrate;
• forming a lower overmold on the lower side of the packaging substrate to cover a lower portion of the radio-frequency circuit assembly;
• forming a plurality of openings through the lower overmold to expose corresponding contact pads on the lower side of the packaging substrate;
• and
• implementing a contact feature within each of the openings of the lower overmold to be in contact with the corresponding contact pad, such that the resulting contact features allow the dual-sided module to be mounted on a circuit board.

A wireless device comprising:

• a circuit board configured to receive a plurality of components;
• a transceiver implemented on the circuit board and configured to process radio-frequency signals;
• and
• a dual-sided module implemented on the circuit board and in communication with the transceiver, the dual-sided module including a packaging substrate having an upper side, a lower side, and a ground plane;
• a radio-frequency circuit assembly implemented on both of the upper and lower sides of the packaging substrate, an upper overmold implemented on the upper side of the packaging substrate to cover an upper portion of the radio-frequency circuit assembly, the upper overmold defining one or more openings dimensioned to expose one or more contact pads on the upper side of the packaging substrate, the one or more contact pads in electrical connection with the ground plane, a conductive layer configured to cover an upper surface and the one or more openings of the upper overmold to be in electrical contact with the ground plane to thereby provide shielding for a region on the upper side of the packaging substrate, a lower overmold implemented on the lower side of the packaging substrate to cover a lower portion of the radio-frequency circuit assembly, the lower overmold defining a plurality of openings, and a contact feature implemented within each of the openings of the lower overmold to allow the dual-sided module to be mounted on a circuit board.