Semiconductor package and electronic device having the same

A semiconductor package comprising:

• a substrate comprising an antenna;
• a heating element disposed on a first surface of the substrate and connected to the antenna;
• a heat radiating part coupled to the heating element;
• a signal transfer part disposed on the first surface of the substrate and electrically connecting the substrate to a main substrate;
• and
• a sealing part substantially enclosing the signal transfer part and the heating element,
• wherein the heat radiating part includes a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other, and
• wherein the heat transfer part is enclosed by the sealing part.