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US 2019/0057916 A1Published application
Semiconductor Device and Method of Manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh
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Abstract
A device includes a substrate with a die over the substrate. A molding compound surrounds the die and includes a structural interface formed along a peripheral region of the molding compound.
Claims20
A method comprising:
- positioning a die over a substrate;
- forming a molding compound around the die, the molding compound having a first width, the first width being measured between a first peripheral edge of the molding compound and a second peripheral edge of the molding compound opposite the first peripheral edge;
- forming a groove in a peripheral region of the molding compound;
- and
- forming a thermal interface material over the molding compound, the thermal interface material having a second width, the second width being measured between a first peripheral sidewall of the thermal interface material and a second peripheral sidewall of the thermal interface material opposite the first peripheral sidewall, the second width being smaller than the first width.
2 more elements
A method comprising:
- bonding a chip to a substrate;
- forming a molding compound around the chip;
- forming a groove in the molding compound, the groove being defined by an outer sidewall proximate an outermost edge of the molding compound and an inner sidewall distal the outermost edge of the molding compound, the inner sidewall encircling a periphery of the chip;
- and
- filling the groove with a thermal interface material, the thermal interface material contacting the chip, wherein an outermost periphery of the thermal interface material is disposed within an outermost periphery of the molding compound.
2 more elements
A method comprising:
- mounting an integrated circuit chip on a substrate;
- forming a molding compound encapsulating sidewalls of the integrated circuit chip;
- forming a first trench in the molding compound, the first trench surrounding a peripheral portion of the integrated circuit chip;
- depositing an interface material over the molding compound, the interface material filling the first trench;
- and
- bonding a lid to the interface material, the lid having a first width in a first direction, the molding compound having a second width in the first direction, the second width being greater than the first width.
3 more elements
Dependencies are inferred from the claim text.